| 摘要 |
An X-ray projection exposure apparatus includes a mask chuck for holding a reflection X-ray mask having a mask pattern thereon, a void being formed between the mask and the mask chuck, a wafer chuck for holding a wafer onto which the mask pattern is transferred, an X-ray illuminating system for illuminating the reflection X-ray mask, held by the mask chuck, with X-rays, an X-ray projection optical system for projecting the mask pattern of the reflection X-ray mask onto the wafer held by the wafer chuck with a predetermined magnification and a supply for supplying the void formed between the mask and the mask chuck with a cooling gas for cooling the mask.
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