| 摘要 |
Selected portions of a ceramic body are copper-plated by first metallizing the selected portions with molybdenum-containing material and then contacting said body with hydrochloric acid to render the non-metallized portions insensitive to the cupric plating solution, followed by immersing the ceramic body in said cupric plating solution whereby only the metallized portions are copper-plated. The molybdenum-containing material is a mixture of molybdenum and manganese, of 2 : 1 ratio by wt., dispersed in a suitable binder, e.g. isobutyl methacrylate thinned with butyl carbitol acetate. The ceramic material may be of the alumina or beryllia type. The Mo-Mn mix is bonded to the ceramic by firing in an atmosphere of hydrogen at 1250 DEG C. for 30 mins. The cured ceramic is then cooled, cleaned in an alkaline solution, rinsed, and then immersed in conc. HCl of 4N-9N strength, followed by re-rinsing before plating. The cupric plating solution contains a cupric salt, e.g. sulphate or nitrate, alkali metal tartrate or citrate dissolved in caustic soda, and a water-soluble aldehyde, e.g. formaldehyde. The acid-treated metallized ceramic body is immersed in the plating solution at room temperature for 10 mins. Subsequently, the copper-plated metallized portions may be over-plated with nickel-silver or gold. The Specification lists suitable copper, nickel and gold plating solutions and also the alkaline cleaning composition. |
