| 摘要 |
PURPOSE: To obtain a wet-cleaning apparatus and wet-etching method, that can reduce fluctuation in product characteristics by making uniform the amount of etching in a wafer, when using etching liquid, such as a fluoric acid to etch a wafer an oxide film in wet cleaning treatment and the like. CONSTITUTION: A means for improving uniformity of etching is provided, where the means is provided in a cleaning tank 16, and turns a wafer 18 along a prescribed circumferential direction at a prescribed speed in an arbitrary period during the circulation of the cleaning liquid, so that wet treatment throughput on the wafer 18 lies within an approximately specific range.
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