发明名称 |
APPARATUS FOR INCREASING CONTACT AREA OF COOLING FIN FOR HEAT SINK |
摘要 |
PURPOSE: An apparatus is provided to achieve a maximized cooling efficiency by increasing contact area between the support base and cooling fin mounted onto the support base. CONSTITUTION: A heat sink(100) comprises a plate-shaped support base(110) mounted inside of a communication equipment; and a cooling fins(120) mounted onto the support base so as to increase a heat radiating surface. The support base has a plurality of cooling grooves(10) having a predetermined width and which are formed in a widthwise direction onto the upper surface of the support base. The cooling fin has a bent portion(20) having a width corresponding to the width of the cooling groove formed at the support base, wherein the bent portion is formed at the lower end of the cooling fin. The cooling fin is coupled through the bent portion into the cooling groove via a bolt(30) so as to thereby increase contact area between the support base and cooling fin.
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申请公布号 |
KR20010093431(A) |
申请公布日期 |
2001.10.29 |
申请号 |
KR20000016032 |
申请日期 |
2000.03.29 |
申请人 |
HYNIX SEMICONDUCTOR INC. |
发明人 |
JUNG, BYEONG SU;LEE, SEUNG JAE |
分类号 |
H05K7/20;(IPC1-7):H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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