| 摘要 |
PURPOSE: A method for manufacturing a lapping carrier is provided to inject an insert material under a desirable condition by controlling an injecting time, an injecting temperature, and an injecting pressure. CONSTITUTION: An insert holder is manufactured by using a laser cutting machine. The inert holder is formed by processing a gear around an outer circumference of a passing hole and a groove around an inner circumference of the passing hole. A surface flatness of the insert holder is improved and a burr of the insert holder is removed by using a surface polishing device. An injected mold is connected with a heater in order to maintain the injected mold under a temperature of 40 to 60 degrees centigrade. The insert holder is loaded on the injected mold. A fused insert material is injected into the groove of the insert holder. A cooling process is performed. A solidified insert(7) is loaded on a press mold in order to process a wafer loading connection hole.
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