| 摘要 |
PROBLEM TO BE SOLVED: To provide a device for plating printed circuit boards in which, first, a copper plating solution passes sufficiently and without failure through a through-hole to deposit a uniform copper plating film having a uniform thickness as that on the outer surface on the inner wall face of the through-hole and, second, such a result is easily realized with a simple structure. SOLUTION: This plating device 9 is used in a stage for manufacturing a printed circuit board and provided with a liquid tank 16 for the copper plating solution C, a conveyor set in the solution C of the tank 16, nipping and conveying printed circuit board members B and a suction pipe 20 of an anode opposed to the members B. The suction pipe 20 is furnished with an inlet 22, the inlet 22 is slit-shaped and arranged to cover the whole width of the material B in a horizontal direction E, and the solution C in the tank 16 is sucked in from the inside and outside of the through-hole A.
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