| 摘要 |
PROBLEM TO BE SOLVED: To provide a non-cyanide bath by which copper-tin alloy plating capable of industrially, safely and sanitarily yielding ornamental copper-tin alloy plating as a substitute for nickel plating and lead-free soldering. SOLUTION: In a pyrophosphoric acid bath for copper-tin alloy plating containing copper ions and tin ions, the 1:1 reaction product (A) of an amine derivative and epihalohydrin, a cationic surfactant (B), a surface tension regulator (C) as required, and a bath stabilizer (D) are incorporated as additives.
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