| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a memory module which can simplify a rework step even when a failure is confirmed in a lamination step after a mounting step in which a semiconductor memory device is mounted on a host substrate, and further can simply attain an increase in capacitance even in an elemental module substrate. SOLUTION: This memory module 1 comprises child substrates 5, 5,... which comprise electrodes which are electrically connected to a semiconductor memory device 4 in a marginal part, and also in which a single or plurality of the semiconductor memory devices 4 are mounted; and a module substrate 2 in which the child substrate 5 is mounted, and sockets 3, 3,... which are electrically connected to the electrodes of the marginal part of the child substrate 5 are provided on the surface.</p> |
