| 摘要 |
PROBLEM TO BE SOLVED: To provide a solid-state image pickup device for removing static electricity and preventing the destruction or deterioration of elements, by providing a transparent conductive film on the glass of a cap, conducting this film to the wiring of a flexible substrate and performing discharging through this film concerning a thin solid-state image pickup device, in a structure for sticking and sealing the glass of the gap on a solid-state imaging device mounted on a TAB tape or the like. SOLUTION: The configuration of the solid-state image pickup device with which a beam lead provided on a flexible wiring board is connected to a metal projection provided on the connecting part of the solid-state imaging device around an image pickup area of the solid-state imaging device chip, while making an opening part formed on the flexible wiring board correspondent to the image pickup area. The cap composed of transparent glass for protecting the solid-state imaging device chip is mounted so as to cover the opening part, the transparent glass and a seal layer are deposited in this order around the outer periphery of the solid-state imaging device chip, and the valid pixel area of the solid-state imaging device chip is surrounded with the seal layer. A transparent conductive film is provided on the cap while facing the valid pixel area. |
