SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To enhance a manufacturing yield of a semiconductor device. SOLUTION: This semiconductor device comprises: a resin sealing body; a plurality of semiconductor chips which are positioned inside the resin sealing body, of which flat surfaces are rectangularly formed, which have a first major surface and a second major surface opposed to each other, and in which an electrode on a first side out of a first side and a second side opposed to each other in the first major surface is disposed; and an inner part positioned inside the resin sealing body and an outer part positioned outside the resin sealing body, the inner part being electrically connected to the electrodes of the plurality of semiconductor chips via a bonding wire. The plurality of semiconductor chips are stacked in a state that each first major surface is directed to the same direction so that each first side is positioned on the same side, and further the electrodes of the one semiconductor chip confronting each other are shifted in respective positions so as to be positioned in an outer part of the first side of the other semiconductor chip.