| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a manufacturing method for a printed wiring board which prevents the sagging of paste from the opening face of a through hole caused by the drop of viscosity of the paste occurring at heat treatment of the hole stopping paste filled in a through hole, and the occurrence of recess of the through hole face opening face accompanying it, and a multilayer printed wiring board using it. SOLUTION: A mask for stopping a hole, which has a through hole made in a position corresponding to a through hole, is placed on a substrate, and hole stopping paste whose viscosity at 22-23 deg.C is 300 Pa.s or over is press-filled in a through hole through a through hole from above the hole stopping mask, using a pressure-filling type of squeeze.</p> |
