| 摘要 |
PROBLEM TO BE SOLVED: To provide a film for an electronic component which can realize reduction in cost. SOLUTION: In a film for an electronic component where a plurality of products are disposed at a required first interval in a widthwise direction of a film in each line, and a via hole is opened in a matrix shape at a first pitch (p) in the widthwise direction of a film and at a second pitch (q) in the longitudinal direction of a film inside each product, the first interval is an integral multiple of the first pitch (p).
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