发明名称 |
MODULAR ELECTRICAL CONNECTOR |
摘要 |
<p>PROBLEM TO BE SOLVED: To obtain a modular electrical connector of an array connector having a relatively large array pattern or multiple components forming parallel groups. SOLUTION: The modular construction of connectors is provided for reducing the effect of the difference of the thermal expansion coefficient between the connector and the circuit board underneath it. Each connector of the modular construction is mounted on a known circuit board or the like and it can house an integrated circuit chip carrier or can be mounted on other circuit board. The principle of solder surface tension and self-centering characterized in ball grid array(BGA) surface mounting technique is used for forming an array connector having a relatively large array pattern or multiple components forming parallel groups.</p> |
申请公布号 |
JP2001297812(A) |
申请公布日期 |
2001.10.26 |
申请号 |
JP20010061602 |
申请日期 |
2001.03.06 |
申请人 |
BERG TECHNOL INC |
发明人 |
DONALD K HERPER |
分类号 |
H01R12/52;H01R13/514;H01R33/76;H01R43/00;H01R43/02;H05K7/10;(IPC1-7):H01R12/22;H01R12/04 |
主分类号 |
H01R12/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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