发明名称 INTEGRATED CIRCUIT
摘要 <p>PROBLEM TO BE SOLVED: To store temperature calibration data in an LSI at the time of manufacturing the LSI and to make it possible to measure chip temperatures with high precision and non-manually even after it is assembled in an electronic device. SOLUTION: A voltage measuring circuit 3 flows a current from a constant current circuit 4 to a thermal element 2. A voltage measuring circuit 5 measures a voltage between both poles of the thermal element 2, and outputs the measured results to an AD conversion circuit 7. An operation circuit 8 inputs voltage data outputted from the AD conversion circuit 7 and temperature calibration data outputted from a nonvolatile correction holding circuit 6, operates the calibrated temperature data, and outputs them to a control means 10 via a readout interface 9. The control means 10 controls a cooling mechanism control device 12 to raise cooling capability, controls temperatures of an LSI 1 to be within operation guarantee temperatures, and further controls are power supply control device 11 to turn off a power supply in order to protect the LSI from burning, etc. The temperature calibration data to be stored in the holding circuit 6 are obtained by inspecting characteristics of the thermal element 2 before the power supply is supplied to the LSI 1.</p>
申请公布号 JP2001298160(A) 申请公布日期 2001.10.26
申请号 JP20000114913 申请日期 2000.04.17
申请人 HITACHI LTD 发明人 NAKAYAMA KIWAMU
分类号 G01R31/26;G01R31/28;H01L21/822;H01L27/04;(IPC1-7):H01L27/04 主分类号 G01R31/26
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