发明名称 PACKAGE STRUCTURE OF MULTI-BAND SURFACE ACOUSTIC WAVE FILTER
摘要 PURPOSE: A package structure of a multi-band surface acoustic wave filter is provided to prevent an RF(Radio Frequency) feed-through by forming SAW(Surface Acoustic Wave) filters having two or more characteristics within one package. CONSTITUTION: A package(50) emits an internal heat to protect internal circuits and performs a connecting function with external circuits. Two SAW filters(51,52) having two or more passing bands(51,52) are installed on a filter die(53) within the package(50). A metal bar(54) is installed the center portion of the filter die(53). The metal bar(54) is located between the SAW filters(51,52) in order to intercept an RF feed-through. A wire(56) is used for connecting a multitude of pad(55) installed at the SAW filters(51,52) and the package(50).
申请公布号 KR20010092582(A) 申请公布日期 2001.10.26
申请号 KR20000014616 申请日期 2000.03.22
申请人 LG INNOTEC CO., LTD. 发明人 JANG, HUI SEONG
分类号 H03H9/64 主分类号 H03H9/64
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