RESIN-SEALED TYPE SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a small resin-sealed type semiconductor device at low cost capable of enlarging a creeping distance between leads, reducing mechanical stress to a semiconductor pellet and the numbers of parts, and realizing good heat radiation. SOLUTION: A lower side of an outer edge 1b of a first lead 1 is flushed with a lower side of a resin-sealed part 4, and a rising part 1c in succession to the outer edge 1b is buried in the resin-sealed part 4. A semiconductor pellet 3 is stuck to an inner edge 1a of the first lead 1. While surface of the semiconductor pellet 3 and an inner edge 2a of a second lead 2 are stuck, the second lead 2 is extended from an inner edge 2a in the horizontal direction and dislocated downward as a crank at a position in an exposed state from the resin-sealed part 4. The outer edge 2b of the second lead 2 is made flush with the lower part of the resin-sealed part 4.