发明名称 FLEXIBLE WIRING BOARD, FILM CARRIER, TAPE-LIKE SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD CIRCUIT BOARD AND ELECTRONIC APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a flexible wiring board in which stress can be relaxed, a film carrier, a tape-like semiconductor device, semiconductor device and method of manufacture, circuit board and an electronic apparatus. SOLUTION: The flexible wiring board 1 comprises an elongated base board 10, and a plurality of wiring patterns 20 formed on the base board 10 wherein each wiring pattern 20 comprises inner leads 26, 28 and the base board 10 is provided, at a position shifted from the inner leads 26, 28 in the widthwise direction thereof, with a slit 40 extending in the longitudinal direction of the base board 10.
申请公布号 JP2001298056(A) 申请公布日期 2001.10.26
申请号 JP20000115271 申请日期 2000.04.17
申请人 SEIKO EPSON CORP 发明人 YANAGISAWA MASAHIKO
分类号 H05K1/02;H01L21/60;H01L23/12;(IPC1-7):H01L21/60 主分类号 H05K1/02
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