| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a plastic package capable of assuring an airtight reliability by preventing a crack of a copper plated resin board by an Au-Sn alloy for bonding a solder ball. SOLUTION: The method for manufacturing the plastic package comprises the steps of forming a profile size of a pattern for the solder ball pad to be formed at a semiconductor layer on a resin board 11 to be larger than that of the pad 15, forming a first solder resist layer 19a having an opening matched to the profile size of the pad 15 while covering an outer peripheral end of the pattern for the pad 15, executing Au-plating 18 in the opening for the pad 15, and forming a second solder resist layer 19b on an upper part of the layer 19a and an air gap after a routed wiring pattern for plating is removed. |
