CHEMICAL MECHANICAL PLANARIZATION SYSTEM

摘要

PROBLEM TO BE SOLVED: To provide a chemical mechanical wafer planarization system which can be improved easily in throughput. SOLUTION: A processing system and method for processing a workpiece are generally provided. In one embodiment, the system includes a processing module and a substrate transfer shuttle. The processing module includes a polishing surface and at least one polishing head disposed above the polishing surface. The substrate transfer shuttle is movable between at least a first position and a second position where the second position is disposed adjacent to the polishing head. At least one nest is disposed therein to receive and align the substrate. The nest also facilitates the transfer of the workpiece to the processing head.