SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR THE SAME

摘要

PROBLEM TO BE SOLVED: To solve the problem of not meeting the requirement for a thin semiconductor device in future due to the fact that the conventional semiconductor devices cannot be remarkably minimized or thinned because then use lead members or the like. SOLUTION: The semiconductor device comprises a chip-like semiconductor substrate 8 protected on its surface by a solder resist 7, and a side electrode 9 in continuity with an element electrode on its surface. A method for manufacturing the semiconductor device comprises the steps of bringing the electrode 9 in a continuity via the element electrode 10 of the front surface of the substrate 8 and metal wirings 11, externally exposing a semicircular circumferential part constituted by cutting a through hole 12 as the side electrode, and forming the resist 7 in the semicircular state to function to protect the electrode. With this constitution, the small-sized thin and mounting surface area-saving type semiconductor device can be realized without using an external members such as the leads or the like.