| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem of the conventional mounting means by chick components are mounted on the solder on a substrate before melting, hence the mounting height of the mounted components adhered to the substrate is not fixed because of the thickness variation of the adhering solder, the mounted components are tilted, the mounting height variation of the components or tilt between the mounted components exceeded an allowable range of the optical axis adjustment, and the light receiving surface height of the mounted components and the optical path are not aligned to result in the growth of an optical loss. SOLUTION: The surface of a mounted component 13 is aligned with an extension plane of the surface of a reference component 3 at a high accuracy. Thus, the mounting positional relation between the components can be accurately held to enable the high accuracy mounting for mounting optical modules, etc., irrespective of the thickness variation of solder 14, the mounting position failure of the reference component 3 and the distortion of the substrate 2.
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