| 摘要 |
<p>The method comprises the creation of conducting bosses on a plastic support (5). This is done by stamping the support, when hot, with a metal foil sheet (3) arranged above it, using a template (1). The upside-down integrated circuit is mounted on the bosses. The template tool (1) for stamping the support (5) has small cavities corresponding to the positions in which the conducting bosses will be created in the plastic support. As the support is hot when stamped, it flows into the cavities within the template (1), with the metallic foil forming conducting bosses on top of the bosses.</p> |
