发明名称 |
METHOD OF TREATING OR COVERING SURFACE OF MATERIAL |
摘要 |
PROBLEM TO BE SOLVED: To provide a method of uniformly treating or covering at least a part of a surface of a material to be selected from a metal and/or a polymer having a thickness of less than 100μm. SOLUTION: This method includes the exposition of at least a part of the surface of the material to the normal pressure plasma generated by an indirect plasmatron. In this method, the surface of the material can be subjected to at least the increase in the surface tension, the surface grafting, the surface cleaning and the surface sterilization.
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申请公布号 |
JP2001295051(A) |
申请公布日期 |
2001.10.26 |
申请号 |
JP20010056767 |
申请日期 |
2001.03.01 |
申请人 |
WOLFF WALSRODE AG |
发明人 |
KUCKERTZ CHRISTIAN;JACOBSEN SVEN;BRANDT RAINER;LANDES KLAUS;HARTMANN RALF |
分类号 |
C08J7/00;B05D3/14;B29C59/14;C23C4/00;C23C8/36;C23C16/50;H05H1/34;(IPC1-7):C23C16/50 |
主分类号 |
C08J7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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