| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a chip inductor, by which a chip inductor mounted precisely by flattening the mounting surface of its outer packaging section can be manufactured. SOLUTION: This method includes a conductive layer forming step of forming a conductive layer 4 on the outer peripheral surface 2 and end faces 3 of the main body 1 of the chip inductor; a coil section forming step of forming a coil section 7 having linear conductor sections 5 and grooved sections 6, while the cut dusts 10 of the conductive layer 4 are scattered by making grooves on the conductive layer 4 formed on the outer peripheral surface 2 of the main body 1 in a coil-like state; and an etching step of etching the main body 1 carrying the formed coil section 7. This method also includes an insulating resin coating step of forming the outer packaging section 8 by coating the conductive layer 4 on the outer peripheral surface 2 side of the etched main body 1 with an insulating resin 13, and an electrode forming step of forming electrode sections 9 at both ends of the coil section 7 and, at the same time, electrically connecting the sections 9 to the conductive layer 4.
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