发明名称 THIN-TYPE TEMPERATURE FUSE
摘要 PROBLEM TO BE SOLVED: To provide a thin temperature fuse, capable of safely holding the bonding area between a fuse element and a lead conductor, in spite of bending action on the fuse body. SOLUTION: A low-melting point fusible alloy piece 2 is connected between band lead conductors 1, 1. A cover resin film 4 in the temperature fuse, which has the low-melting point fusible alloy piece 2 sealed together with a flux 5, by surrounding fusion between a base resin film 3 which extends over the ends of both lead conductors and the cover resin film 4, is provided with another step b which is other than a step a, based on the sealing between an upright position of each bonding area 6, located between each lead conductor and the low-melting point fusible alloy piece, and each longitudinal end 41 of the cover resin film.
申请公布号 JP2001297673(A) 申请公布日期 2001.10.26
申请号 JP20000111711 申请日期 2000.04.13
申请人 UCHIHASHI ESTEC CO LTD 发明人 KAWANISHI TOSHIAKI
分类号 H01H37/76;(IPC1-7):H01H37/76 主分类号 H01H37/76
代理机构 代理人
主权项
地址