| 摘要 |
PROBLEM TO BE SOLVED: To provide a unit for mounting a ball electrode that can securely transfer the ball electrode such as a solder ball to a specific substrate region without relying on air-blowing strength. SOLUTION: In a vacuum chamber 11, at least the inside is controlled under negative pressure. Also, in the vacuum chamber 11, a suction plate 12 having suction holes 121 of a plurality of solder balls HB are arranged on the specific outer surface. In addition, in the vacuum chamber 11, a slide plate 13 is provided at the back of the suction plate 12. The slide plate 13 has the arrangement of opening part with a diameter that nearly coincides with a hole that is smaller than, for example, the bottom of the suction hole 121, namely the diameter of the solder ball HB. The slide plate 13 slides when the solder ball HB is to be transferred, and can give a bottom to the suction hole 121.
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