| 摘要 |
PROBLEM TO BE SOLVED: To provide a miniaturizable inspection device for a semiconductor device by using in common a line camera for the X-axis direction and for the Y-axis direction for imaging a semiconductor chip on a lead frame and its periphery, and having an automatic calibration means of a correction coefficient, installed thereon capable of supporting stably the lead frame at the imaging time and executing three-dimensional correction of the obtained image- processing data, and enhancing power saving of wire bonding inspection and improvement of reliability, and to provide an inspection method. SOLUTION: This inspection device has a formation, in which the arrangement direction of an imaging element of the line camera 9A is interlocked with the scanning direction of a galvanomirror 7 on X-Y two axes switchable in the X-axis direction or in the Y-axis direction, and an intermediate rib 5B is installed on a pallet 5. The lead frame 1 is vacuum-sucked on a loading surface 5A of the pallet 5 and on the intermediate rib 5B, and also has a formation in which the correction coefficient of the image processing data is automatically calibrated, by using a step-shaped three-dimensional calibration jig 13. |
