| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem of a semiconductor device having an image element that dust may adhere to a pixel during assembling process or moisture may be absorbed after the semiconductor device is assembled to form dews on the semiconductor element side of a glass plate because the space between the semiconductor element and the glass plate is hollow. SOLUTION: A semiconductor substrate 10 where a semiconductor element including an image element 11 is arranged on a resin substrate 16 having an opening 15 is bonded to a wiring metal 17 on the resin substrate through bumps 14. The region of the resin substrate 16 and the bumps 14 is sealed with a sealing resin 18, and the image element 11 of the semiconductor substrate 10 is partially covered with an insulating resin 13. The image element 11 is located at the opening 15 of the resin substrate 16, and solder balls 19 are provided as external terminals on the resin substrate 16. According to the structure, the image element can be protected and since such members as glass plate, and the like, are not required, a small semiconductor device can be realized at a lower cost. |
