发明名称 ALIGNMENT METHOD
摘要 <p>PROBLEM TO BE SOLVED: To solve a problem that the position of the edge of an alignment mark cannot be detected, and groove-machining positioning cannot be made. SOLUTION: A first layer 110 that becomes a core layer is formed on a substrate 100. Then, a mask layer 120 is formed in a core formation region on the first layer 110, and an alignment mark 130 is formed in an alignment mark formation region on the first layer 110. The alignment mark 130 is used as a groove-machining marker, and is covered with a protection layer 140, The width of the protection layer 140 is made lager than that of the alignment mark 130. Also, the protection layer 140 is made of a transparent material. With the mask and protection layers as a mask, the first layer 110 is etched. The mask layer is removed, thus forming a core 150. A structure that is formed in above processes is covered with a second layer 160 that becomes cladding. Then, the detection process of the alignment mark is carried out by detecting the edge of the alignment mark 130 with light.</p>
申请公布号 JP2001297963(A) 申请公布日期 2001.10.26
申请号 JP20000110816 申请日期 2000.04.12
申请人 OKI ELECTRIC IND CO LTD 发明人 TAKAHASHI HIROMI;ONO HIDEKI
分类号 G02B6/13;G03F9/00;H01L21/027;H01L23/544;(IPC1-7):H01L21/027 主分类号 G02B6/13
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