ELECTRONIC COMPONENT AND MOUNTING STRUCTURE OF THIS ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To solve a problem of a decrease in connecting reliability of a solder connecting part by generating a difference of displacement amounts of an expansion and a contraction of the connecting part due to different thermal expansion coefficients of a printed circuit board and a CSP and generating a thermal stress at a part for connecting a land to a solder bump. SOLUTION: A solder bump 27 disposed at the part corresponding to a periphery 23B of an IC chip 23 of an interposer 21 is not used for an electrical continuity at the CSP 1.