发明名称 LOW PERMITTIVITY MATERIAL AND PROCESS
摘要 PROBLEM TO BE SOLVED: To manufacture multilayer films having a low permittivity. SOLUTION: Chemical vapor deposition processes produce films having low permittivity when suitable chemical precursors are utilized. Preferred chemical precursors include siloxanes, (fluoroalkyl)flourosiloxanes, (fluoroalkyl)silanes, (alkyl)fluorosilanes, (fluoroalkyl)fluorosilanes, alkysiloxysilanes, alkoxysilanes, alkylalkoxysilanes, silylmethanes, alkoxysilylmethanes, alkylalkoxysilymethanes, alkoxymethanes, alkyalkoxymethanes, and mixtures thereof. The precursors are particularly suited to thermal CVD for producing low permittivity films at relatively low temperature without the use of additional oxidizing agents. Such films are useful in the microelectronics industry.
申请公布号 JP2001298024(A) 申请公布日期 2001.10.26
申请号 JP20010032000 申请日期 2001.02.08
申请人 ASM JAPAN KK 发明人 TODD MICHAEL A
分类号 C23C16/30;C23C16/40;H01L21/316;(IPC1-7):H01L21/316 主分类号 C23C16/30
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