| 摘要 |
PURPOSE: To provide a wafer polisher capable of highly accurate multistep polishing, without producing wastes in polishing process. CONSTITUTION: The wafer polisher 1 comprises a polishing unit 4, having three platens 41 and two polishing heads 42, and cleaning wafer jet holes 45 at the boundaries between the right and left platens 41a and the center platens 41b. The two polishing heads are movable linearly between the platens. In a twostep polishing, before moving a wafer 10 held with both side platens to the center platen different in polishing characteristic, slurry, etc., deposited to the wafer is washed off with the rinsing water from the jet holes, the wafer is carried over a waiting unit 43 to the center platen and the next polishing is conduict. |
