| 摘要 |
PROBLEM TO BE SOLVED: To provide a bump height measurement method that can quickly and accurately measure the height of a bump. SOLUTION: In this bump height measurement method for measuring the height of a projection-shaped bump B that is formed on the surface of a substrate W, light is applied to the bump at a specific elevation angle to project the shadow of the bump onto the substrate, the shadow length of the bump is obtained according to shadow region information and image information where the image of the shadow region is picked up, and the height of the bump is obtained according to the shadow length and elevation angle. |
