| 摘要 |
Disclosed is a cutting apparatus equipped with a means for alignment of its rotary blade relative to a selected street on a semiconductor wafer. The cutting apparatus has a marking member positioned at such a place that the rotary blade can make a mark of cutting position in an indexing direction on the marking member, thereby permitting the rotary blade to be put in precise alignment relative to a selected cutting line on the semiconductor wafer by adjusting the rotary blade in the direction traversing the street-cutting direction until the trace of the rotary blade has been put in alignment with a reference hairline.
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