发明名称 Substrate processing method and substrate processing apparatus
摘要 After a thin liquid agent film is formed by supplying a liquid agent onto a plate-like developer holder, this liquid agent film and the surface of a substrate are opposed. The liquid agent film and the substrate are brought into contact with each other at a point by declining the substrate and moving it close to the liquid agent film, or by curving the substrate toward the liquid agent film. Then, the substrate is made parallel to the liquid agent film, and the liquid agent is supplied such that the contact area of the liquid agent film spreads over the entire surface by the interfacial tension between the liquid agent film and the substrate. Since a thin liquid agent film can be uniformly formed below the substrate, processing can be performed with a small consumption amount. Additionally, the liquid agent can be supplied to the substrate without holding air.
申请公布号 US2001033894(A1) 申请公布日期 2001.10.25
申请号 US20010805034 申请日期 2001.03.14
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 NAKAMURA HIROKO;KANEKO HISASHI;MATSUDA TETSUO
分类号 G03F7/30;B05C1/02;B05C9/02;B05C11/08;B05D1/28;H01L21/00;H01L21/027;H01L21/683;(IPC1-7):B05D3/12;B05C13/02 主分类号 G03F7/30
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