Manufacturing computer systems with fine line circuitized substrates

摘要

The present invention provides a method for electrolessly depositing metal onto a substrate, comprising: exposing a surface of the substrate to a first solution including a surfactant; and exposing the surface, having residual surfactant from the first solution thereon, to a second solution including ions of an electroconductive metal element for plating the surface with the electroconductive metal while exposed to the second solution; wherein the surface is exposed to the first solution immediately prior to exposing the surface to the second solution.