发明名称 |
CMP UNIFORMITY |
摘要 |
Improved CMP uniformity is achieved by providing improved control of the slurry distribution. Improved slurry distribution is achieved by, for example, the use of a slurry dispenser that dispenses slurry from a plurality of dispensing points. Providing a squeeze bar between the slurry dispenser and wafer to redistribute the slurry also improves the slurry distribution.
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申请公布号 |
US2001034134(A1) |
申请公布日期 |
2001.10.25 |
申请号 |
US19990271684 |
申请日期 |
1999.03.18 |
申请人 |
LIN CHENTING;VAN DEN BERG ROBERT;PANDEY SUMIT |
发明人 |
LIN CHENTING;VAN DEN BERG ROBERT;PANDEY SUMIT |
分类号 |
B24B37/04;B24B57/02;H01L21/302;H01L21/304;(IPC1-7):H01L21/302;C23F1/02;H01L21/461 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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