发明名称 |
Laser cutting method for cutting microscopic samples |
摘要 |
<p>The laser cutting method involves bringing an object carrier (10) with a sample (12) to be cut into a microscope (1) which has at least one objective lens (6). Using the objective lens, a region to be cut out is determined. A cut line is defined around the region. A laser beam (4b) is generated through an aperture (18) so that its diameter is reduced such that a laser aperture (36) generated through the lens (6) is smaller than the lens aperture (34) of the lens itself. The sample is then cut along the cut line. Independent claims also cover an apparatus for carrying out the method.</p> |
申请公布号 |
DE10018255(A1) |
申请公布日期 |
2001.10.25 |
申请号 |
DE2000118255 |
申请日期 |
2000.04.13 |
申请人 |
LEICA MICROSYSTEMS WETZLAR GMBH |
发明人 |
GANSER, MICHAEL;WEIS, ALBRECHT;STENZEL, RUEDIGER |
分类号 |
G01N1/06;B23K26/00;B23K26/066;G01N1/04;G01N1/28;G02B21/32;(IPC1-7):G01N33/48;G02B21/00 |
主分类号 |
G01N1/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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