发明名称 Vorrichtung zum Befestigen einer Wärmeverteilungsabdeckung auf einer Leiterplatte
摘要 The invention relates to a device for fixing a heat distribution cover (1) on a printed circuit board (2), comprising a plurality of electronic components (4) and a printed conductor level (5) as well as at least one fixing foot (7), which supports a fixing element (8) that can engage with the heat distribution cover (1).
申请公布号 DE10017925(A1) 申请公布日期 2001.10.25
申请号 DE2000117925 申请日期 2000.04.11
申请人 INFINEON TECHNOLOGIES AG 发明人 POHL, JENS;BAUER, MONIKA
分类号 H05K7/20;(IPC1-7):H05K7/20 主分类号 H05K7/20
代理机构 代理人
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