发明名称 APPARATUS AND METHOD FOR PROVIDING MECHANICALLY PRE-FORMED CONDUCTIVE LEADS
摘要 The present invention is directed toward an apparatus and method for providing mechanically pre-formed conductive leads. In one embodiment of the invention, the apparatus includes a forming chuck (210) engageable with a first surface of a conductive sheet (60), and a receiving chuck (220) engageable with a second surface of the conductive sheet opposite the forming chuck. The forming chuck (210) has a raised forming portion alignable with one or more lead members (68, 69) formed in the conductive sheet (60), and the receiving chuck (220) has a receiving portion (224, 226) alignable with the forming portion (212, 214, 216, 218) and shaped closely to conform to at least part of the forming portion. The conductive sheet (60) is compressed between the forming chuck (210) and the receiving chuck (220) to mechanically pre-form the one or more lead members into one or more pre-formed conductive leads.
申请公布号 WO0124231(A3) 申请公布日期 2001.10.25
申请号 WO2000US40682 申请日期 2000.08.18
申请人 MICRON TECHNOLOGY, INC. 发明人 ELLIS, RONALD, W.;REYNOLDS, TRACY;BETTINGER, MICHAEL
分类号 H01L21/48;H01L21/60;H01L21/607;(IPC1-7):H01L21/44;H05K3/30;H01R43/00 主分类号 H01L21/48
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