发明名称 |
Structure and method for multiple diameter via |
摘要 |
The present invention relates to the production of an improved via for attaching electrical connection pins to printed circuit boards. The inventive via provides a connection having robust mechanical attachment and minimal capacitance effects. The via provides a wide diameter for accepting an electrical connection pin and a reduced diameter along other portions of the length of the via for reduced capacitance and reduced electrical discontinuity.
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申请公布号 |
US2001032388(A1) |
申请公布日期 |
2001.10.25 |
申请号 |
US20010885851 |
申请日期 |
2001.06.20 |
申请人 |
MORRIS TERREL L. |
发明人 |
MORRIS TERREL L. |
分类号 |
H01R12/04;H01R4/02;H05K1/11;H05K3/34;H05K3/42;H05K3/46;(IPC1-7):H01K3/10;B23B39/00;H05K3/02 |
主分类号 |
H01R12/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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