EXTREME DENSITY PACKAGING FOR ELECTRONIC ASSEMBLIES

摘要

Electronic processing components which may be employed in an aircraft or space craft may be packaged in extreme density module. The module (10) may include a high density interconnect module (14) which provides for the interconnection and routing of data and other signals from processing. On the exterior of the HDI module (14) may be a number of conductive contacts (42) which may be used to receive and transmit signals from the HDI module (14). An interposer device may be provided which also includes conductive contacts (42) which may be aligned with the conductive contacts (42) of the HDI modules. Data and other signals may be routed through the interposer device (16) to a motherboard (18) which also includes external contacts (54) which are laid out in a pattern to match those on the interposer device (16). The components described above may be placed between a base and frame bracket (12) and a compressive force applied in order to establish and maintain the electrical contacts. A flexible input-output line (56) may then run from the motherboard device (18) in order to route and receive signals from external systems.