发明名称 Method of fabricating a wide-based box- structured capacitor containing hemi-spherical grains
摘要 A method of fabricating a wide-based boxed-structured capacitor containing hemi-spherical silicon grains. A substrate is provided with a source/drain and a first dielectric layer is formed on the substrate with a node contact opening. Then a doped polysilicon layer and a doped amorphous silicon layer are formed sequentially on the first dielectric layer. An etching step is performed to etch the doped amorphous silicon layer and the doped polysilicon layer and a wide-based lower electrode is formed by adjusting flow speeds of chlorine and of hydrogen bromide. Hemi-spherical silicon grains are formed on the surface of the doped amorphous silicon layer in the lower electrode. A second dielectric layer and an upper electrode are formed sequentially on the lower electrode and the capacitor is completed.
申请公布号 US2001032994(A1) 申请公布日期 2001.10.25
申请号 US20010853004 申请日期 2001.05.09
申请人 CHERN HORNG-NAN 发明人 CHERN HORNG-NAN
分类号 H01L21/02;H01L21/768;H01L21/8242;(IPC1-7):H01L29/00;H01L29/76;H01L27/108;H01L21/20;H01L29/94 主分类号 H01L21/02
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