发明名称 SEMICONDUCTOR PROCESS CARRIER AND BRIDGE CLIP ASSEMBLY
摘要 <p>A semiconductor process carrier (230) and a bridge clip (110) that is capable of retaining a coupon (60) comprises a horizontal sheet metal web portion (112) the ends of which are formed into legs (114, 116) having a generally 'T' shaped plan extending downward from the ends of the web portion. The legs engage a corresponding pair of 'T' shaped apertures (232, 234) adjacent opposite walls of a coupon aperture (262) in the process carrier. The tangs (134, 136) of the legs engage the underside of the process carrier laterally outward of the narrow section of the 'T'-shaped aperture. Because the legs engage the lateral underside of the process carrier any bowing of the bridge clip will not cause the tangs to lose engagement with the underside of the process carrier.</p>
申请公布号 WO2001080370(A1) 申请公布日期 2001.10.25
申请号 US2000017174 申请日期 2000.06.21
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