| 摘要 |
<p>A microdisplay packaging includes a stiffener and a microdisplay including a semiconductor substrate coupled with the stiffener. Multiple electrical contacts connect the microdisplay to an external electrical input source. An electrical connection is disposed between the contacts and the external electrical input source. A covering substrate is disposed over the semiconductor substrate, wherein the covering substrate has a conducting layer thereon, and the conducting layer is electrically coupled to an opposing electrical terminal to the external electrical input source connected to the contacts through the electrical connection. An electro-optic material is disposed between the conducting layer of the covering substrate and the semiconductor substrate, wherein the conducting layer provides an opposing electrical terminal to the contacts on the semiconductor substrate.</p> |
