发明名称 Thermal/mechanical springbeam mechanism for heat transfer from heat source to heat dissipating device
摘要 A method, apparatus, and article of manufacture for transferring heat is disclosed. The apparatus comprises a first thermally conductive plate; a second thermally conductive plate; and an angularly corrugated member disposed between and in thermal communication first thermally conductive plate and the second thermally conductive plate. The angularly corrugated member has a contiguous periodically repeating cross section which includes a first cross section segment, disposable substantially parallel to and in thermal communication with the first thermally conductive plate, a second cross section segment, disposable substantially parallel to and in thermal communication with the second thermally conductive plate, and a third cross section segment, communicatively coupled to the first surface and the second surface, wherein the third cross section segment forming an angle with the first thermally conductive plate.
申请公布号 US2001033476(A1) 申请公布日期 2001.10.25
申请号 US20010798541 申请日期 2001.03.02
申请人 DIBENE JOSEPH T.;HARTKE DAVID H.;JOHNSON WENDELL C.;DERIAN EDWARD J. 发明人 DIBENE JOSEPH T.;HARTKE DAVID H.;JOHNSON WENDELL C.;DERIAN EDWARD J.
分类号 G06F1/18;H01L23/427;H01R4/64;H05K1/02;H05K1/14;H05K3/30;H05K3/36;H05K7/10;H05K7/20;(IPC1-7):H05K7/20 主分类号 G06F1/18
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