发明名称 Reticle for manufacturing semiconductor integrated circuit
摘要 A reticle for a semiconductor integrated circuit, in which a scribing line region is adjacent to only two end sides of a circuit pattern region, which are at right angles to each other, and a reticle overlap displacement of shot rotation and a shot magnification component can be measured. The scribing line region is adjacent to only first and second end sides of the circuit pattern region, which are at right angles to each other, and the light shielding region is adjacent to third and fourth end sides. First box marks are formed at predetermined portions of the scribing line regions, which face the first and second end sides, respectively. The concave portions are formed at predetermined portions of the light shielding region, which face the third and fourth end sides, respectively, and each of the second box marks are formed in the concave portions. The light shielding film patterns for light-shielding latent images due to the second box marks by exposure shots to adjacent portions are formed.
申请公布号 US2001033976(A1) 申请公布日期 2001.10.25
申请号 US20010835516 申请日期 2001.04.17
申请人 SOENOSAWA MASANOBU 发明人 SOENOSAWA MASANOBU
分类号 G03F1/08;G03F1/42;G03F7/20;H01L21/027;(IPC1-7):G03F9/00 主分类号 G03F1/08
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