发明名称 PHOTOSENSITIVE RESIN COMPOSITION
摘要 <p>A photosensitive resin composition which not only is excellent in various performances such as evenness, heat resistance, transparency, and chemical resistance but also is capable of easily forming a finely patterned thin film having excellent low-dielectric characteristics. The photosensitive resin composition comprises: a polymer which is obtained by reacting an alicyclic olefin polymer with a compound having an acid group or an acid derivative group to obtain an alicyclic olefin polymer containing acid groups or acid derivative groups and subsequently reacting the resultant polymer with a compound having a polymerizable unsaturated group to obtain an alicyclic olefin polymer containing polymerizable unsaturated groups and acid groups or acid derivative groups; a photopolymerization initiator; and as an optional ingredient a hardener reactive with a hydroxyl group or the acid group or acid derivative group or a crosslinking agent having a polymerizable unsaturated group.</p>
申请公布号 WO2001079325(P1) 申请公布日期 2001.10.25
申请号 JP2001003296 申请日期 2001.04.18
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