发明名称 Joining of metal for high heat dissipation, such as heat sink, involves applying solder paste containing tin and zinc to junction of metal such as (aluminum) alloy or (copper) alloy, and removing solder paste
摘要 A solder paste containing tin and zinc is applied to junction portions of two or more metal chosen from aluminum, aluminum alloy, copper and copper alloy, so as to join the metal. The solder paste is then removed. Independent claims are also included for the following: (i) Joined material which is joined using the joining method; (ii) Solder paste used for joining the metal; (iii) Flux used for the solder paste; and (iv) Electronic machine equipped with the joined material.
申请公布号 DE10114191(A1) 申请公布日期 2001.10.25
申请号 DE20011014191 申请日期 2001.03.23
申请人 SHOWA DENKO K.K., TOKIO/TOKYO 发明人 SHOJI, TAKASHI;AMITA, HITOSHI;MURASE, NORIKO;NAGASAKI, SHUNSUKE
分类号 B23K1/00;B23K1/008;B23K1/19;B23K35/02;B23K35/26;B23K35/36;B23K35/363;B23K101/42;H05K3/34;(IPC1-7):B23K35/24 主分类号 B23K1/00
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