| 摘要 |
Wafer polishing apparatus (Fig 1) comprises an index unit (2, consisting a plurality of wafer-storing cassettes 21 and robot 22), a load/unload unit (3, with wafer transfer robots 31, 32), a washing unit (5), an electrical installation unit (6) and a polishing unit (4, which includes three platens 41, two waiting units 43, a spindle-washing unit 44 and two polishing heads 42 which can be linearly moved between platens). The multi-stage polishing process involves the transfer of a wafer (10) from cassettes (21) to (un)load unit (3) which in turn transfers it to polishing unit (4). During the polishing procedure, wafer (10) is held by heads (42) after polishing by platens and then transferred, via waiting units 43 which have individually slidable (via cylinder 434) upper-lower two-stage placement tables 431, 432 for temporarily holding the wafer during transfer between (un)load unit (3) and head (42). Upper (loading) table 431 delivers the wafer to head (42) and communicates with feed water pipe (Fig 2, 436) to form a film of water onto upper table, whilst lower (unloading) table 432 receives wafer (10) from head (42). Spindle-washing unit (Fig 6, 44) (comprising a circular brush 442 centred at the holding surface of head 42 and a water injection nozzle 444) is disposed below the placement table. After polishing, (un)load unit (3) transfers wafer (10) to washing unit (5) before returning it cassette (21) via robot (22). |
